Interviewer And Interviewee Guide

A + (Plus) Hardware Interview Question:

ESD damage can be caused by:
A. Placing an IC in a non-conductive plastic bag
B. Placing an IC on a grounded mat
C. Repeated sags in current supplied from outlets
D. Touching metal on the chassis
E. None of the above

Submitted by: Muhammad
Option A
Placing an IC in a non-conductive plastic bag
Submitted by: Muhammad

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